INTEGRATED CIRCUIT

Home INTEGRATED CIRCUIT

CONTACT

WAFER

Sawn

Unsawn

MODULE

Smart card

  • 6-Pins
  • 8-Pins

eUICC

  • MFF2
  • VQFN-8

IoT device

  • SON-8
Contact
Contactless

CONTACTLESS

WAFER

Sawn

Unsawn

MODULE

Thickness

  • 250 μm
  • 350 μm
PRELAMINATE

Polycarbonate

PVC

  • 3 years
  • 5 years

DUAL INTERFACE

WAFER

Sawn

Unsawn

MODULE

Coil on Module (Infineon)

Inductive coupling (SPS)

DUAL_INTERFACE